ElectroMechanical Design Engineer Sr Stf: MicroElectronics

Job Description

Basic Qualifications

Experience with cable harness concepts for subsystem interfaces, generating wiring diagram

Experience in circuit card assembly (CCA) / printed wiring board (PWB) design

Familiarity with high-speed applications and PWB constraints

Job Description

Experience capturing flowed and derived requirements for electromechanical designs

You will be the ElectroMechanical Design Engineer for the Advanced Electronics Packaging team at Lockheed Martin Missiles & Fire Control. Our team pioneers 2 D/3 D heterogeneous packaging concepts, integrating thin film, semiconductor and high performance thermal management technologies to create next generation electronic systems for aerospace and defense missions.

What You Will Be Doing

As the ElectroMechanical Design Engineer you will design, prototype and test cutting edge packaging solutions while collaborating with electrical, systems, test and product design engineers. You will work side by side with Lockheed Martin’s senior Advanced Packaging SME, gaining hands on experience with emerging semiconductor manufacturing processes and translating them into flight qualified hardware. Your responsibilities will include:

Conceiving and modeling 2 D/3 D heterogeneous package architectures that meet size, weight, power and reliability targets.
Developing detailed mechanical and electrical designs for thin film interconnects, semiconductor dies, and advanced thermal management features.
Creating and executing test plans to validate electrical performance, thermal behavior and mechanical integrity of packaging prototypes.
Performing failure analysis and iterating designs based on test data, simulation results and manufacturing feedback.
Preparing comprehensive design documentation, including drawings, BOMs, specifications and verification reports.
Collaborating with cross functional teams (electrical, systems, test, product design) to ensure seamless integration of packaging solutions into larger systems.
Mentoring junior engineers and supporting the Advanced Packaging SME in knowledge transfer and technical guidance.
Staying current with emerging semiconductor and packaging technologies and recommending new approaches for program adoption.
Supporting technology readiness reviews and contributing to risk assessment activities for new packaging concepts.

Why Join Us

Do you want to be part of a company culture that empowers employees to think big, lead with a growth mindset, and make the impossible a reality? We provide the resources and give you the flexibility to enable inspiration and focus. If you have the passion and courage to dream big, work hard, and have fun doing what you love then we want to build a better tomorrow with you.

We offer flexible work schedules to comprehensive benefits investing in your future and security, Learn more about Lockheed Martin’s comprehensive benefits package here.

Further Information About This Opportunity

This position is in Orlando or Grand Prairie. Discover more about our Orlando, Florida location. Discover more about our Dallas, Texas location.

MUST BE A U.S. CITIZEN - This position is located at a facility that requires special access. The selected candidate must be able to obtain a secret clearance.

Desired Skills

Familiarity with SOC / MCP solutions and ASIC verification and validation testing needs at the circuit card level

Experience with parts and materials selections

Ability to perform design trade studies; evaluating cost, weight, packaging, power benefits

Familiarity with CAMEO

Experience with flex circuit design

Micro Electronics design experience.

Other Important Information

By applying to this job, you are expressing interest in this position and could be considered for other career opportunities where similar skills and requirements have been identified as a match. Should this match be identified you may be contacted for this and future openings.

Ability to work remotely

Onsite Full-time: The work associated with this position will be performed onsite at a designated Lockheed Martin facility.