Senior Engineer - Advanced Silicon Packaging

Job Description

Teradar is pioneering a new era in perception with the world’s first automotive terahertz vision sensor, delivering ultra-high resolution imaging in any weather condition. Founded in Boston, Teradar’s solid-state, chip-scale technology unlocks safer, smarter vehicles and opens the door to transformative applications in mobility, defense, and beyond.

We are looking to hire an IC Packaging Engineer who will own the development and delivery of advanced packaging solutions for THz system RFIC & SoC applications. This is a high-impact role that combines technical leadership, hands-on design, and vendor management to bring cutting-edge multi-chip packages into production.

Responsibilities

Technical leadership, guiding the design and execution of advanced IC packages for multi-chip RFIC/SoC integration.
Develop 2.5D packages with UCIe chip-to-chip interconnects and interposer-based solutions.
Work on single-sided and double-sided RDL designs and on-package RF antenna structures.
Co-optimize package designs for signal integrity, power integrity, thermal, and mechanical performance in collaboration with RFIC, digital, and system engineers.
Drive material selection, DFM, and reliability qualification to meet automotive-grade requirements (AEC-Q).
Perform stress, warpage, and thermal simulations using tools such as ANSYS.
Maintain and leverage relationships with OSATs, substrate suppliers, and ecosystem partners to accelerate development.
Create and review electrical performance analysis (signal path length, PDN, crosstalk/noise etc.), mechanical analysis and drawings, stack-ups, and layout constraints.
Lead failure analysis and root cause investigations for packaging and reliability issues and provide solutions to increase yield.
Contribute to the packaging roadmap and scalability plan for automotive volume production.

Key Qualifications

10+ years of experience in IC packaging design and development, including leadership responsibilities.
Proven track record with multi-chip packages, digital + RF integration, and automotive applications.
Deep knowledge of UCIe interconnects, organic substrates, interposers, and advanced packaging architectures.
Experience with RF antenna integration in package designs.
Proficient in Flip-Chip, Fan-Out, 2.5D integration, and heterogeneous system-in-package solutions.
Strong understanding of packaging electrical performance such as signal and power integrity, mechanical stress, thermal management, and reliability analysis.
Established network with packaging vendors and OSATs.
M.S. or Ph.D. in Mechanical Engineering, Materials Science, Electrical Engineering, or related field.
Excellent communication skills and ability to thrive in a fast-paced start-up environment.

Why Join

Technical oversight, defining packaging solutions for breakthrough ADAS technology.
Collaborate with a world-class engineering team spanning RFIC, SoC, and system design.
Be part of a well-funded start-up bringing innovative sensing technology to market.
Competitive compensation, stock options, and flexible work arrangements.