Package Thermal & Mechanical Simulation Engineer

Job Description

Develop simulation models for semiconductor components to predict mechanical reliability and optimize packaging solutions. Analyze the thermal performance of package concepts and collaborate with global teams to solve engineering issues.

Requirements: Requires a Master's or Ph.D. in Mechanical Engineering or an equivalent degree. Proficiency in Finite Element Modelling, specifically with Ansys or Marc Mentat, is required.

Key Skills: Finite Element Modelling, Finite Volume Simulation, Ansys, Marc Mentat, Thermal Analysis, Mechanical Reliability Prediction, Semiconductor Packaging, Virtual Prototyping, Root Cause Analysis, Design Optimization