Lam Research
US - Oregon - Tualatin
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Design and develop mechanical components and subsystems for semiconductor plating equipment to improve performance and reliability. Collaborate with cross-functional teams to translate requirements into detailed designs and support the NPI process through various design reviews.
Requirements: Requires a Bachelor's in Mechanical Engineering with 8 years of experience, or a Master's with 6 years, or a PhD with 3 years. Proficiency in 3D CAD tools like Creo or NX and a strong foundation in mechanical design principles are essential.
Key Skills: Mechanical Design, 3D CAD, Creo, NX, Tolerance Analysis, Thermal-Mechanical Analysis, Structural Integrity, DFMEA, Failure Analysis, NPI Phase-Gate, Computational Modeling, Fluid Dynamics, Electroplating, Semiconductor Manufacturing, Manufacturing Processes, Technical Documentation
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