Process Engineer – Semiconductor Packaging

Job Description

The role is split between developing recipes and control plans for semiconductor packaging processes and leading New Product Introduction for high power LED products. Responsibilities include collaborating with Asian contract manufacturers and managing projects from concept through mass production.

Requirements: Requires a Master's or PhD in engineering, physics, or materials with at least 5 years of experience in semiconductor packaging. Proficiency in wire bonding, die attach, and D/PFMEA is essential, along with the ability to travel internationally up to 20%.

Key Skills: Semiconductor Packaging, Wire Bonding, Die Attach, Dispensing, SPC, Destructive Testing, D/PFMEA, New Product Introduction, Project Management, Hermetic Sealing, Over Molding, Injection Molding, Optical Performance Testing, Control Plan Development, Yield Analysis, Contract Manufacturer Management

Benefits: Medical Insurance, Dental Insurance, Vision Insurance, Paid Time Off, Holidays, 401k Retirement Savings Plan, Employer Match, Flexible Spending Accounts, Employee Assistance Program, Life Insurance, AD&D Insurance