Integrated Photonics Engineer

Job Description

### **Role**

Develop the photonic integrated circuit (PIC) technology at the heart of Azora's high-sensitivity optical transceivers. You will design, simulate, and characterize integrated photonic devices and modules; shepherding them from foundry tape-out through packaging and system integration.

### **Responsibilities**

* Design and simulate integrated photonic components and circuits: waveguides, couplers, 90° hybrids, MZI modulators, phase shifters, photodetector interfaces, and on-chip filters.

* Own foundry tape-outs on silicon photonics, SiN, or InP platforms, including DRC, layout, and process design kit (PDK) workflows.

* Develop test plans and carry out wafer- and chip-level characterization: insertion loss, polarization behavior, bandwidth, responsivity, and phase noise.

* Work with packaging partners on fiber attach, hermetic packaging, and co-packaging with electronics for space environments.

* Integrate PICs into coherent and photon-counting receiver chains and validate end-to-end sensitivity against quantum-limit targets.

* Assess radiation tolerance and thermal behavior of photonic devices for flight applications.

* Collaborate with mixed-signal and FPGA engineers on driver/TIA interfaces and DSP requirements.

### **Required Qualifications**

* MS/PhD in Photonics, Electrical Engineering, Applied Physics, or related field (or equivalent industry experience).

* 3 years of hands-on PIC design and characterization experience.

* Proficiency with photonic simulation and layout tools (Lumerical, Synopsys, KLayout, IPKISS, or similar).

* Experience with at least one commercial foundry PDK and tape-out cycle.

* Strong lab skills: fiber alignment, RF probing, optical test instrumentation (OSA, LCA, tunable lasers).

### **Preferred**

* Experience with coherent optical communications (DP-QPSK/QAM, DSP-based receivers) and/or photon-counting detection.

* Familiarity with free-space-to-chip coupling, optical phased arrays, or integrated beam steering.

* Knowledge of space qualification of photonic components (radiation, TVAC, vibration).

* Experience with hybrid integration (III-V on Si, micro-transfer printing) or co-packaged optics.

**Location**

This is an onsite/hybrid role based in Tempe, AZ or the Bay Area, CA -- hardware work that's hard to do remotely. Some travel expected for field deployment and vendor/manufacturing visits.

**Benefits:**

* Generous equity

* Competitive healthcare (including options for vision and dental)

* 401(k)

* Unlimited PTO

**EEO \& Reasonable Accommodations**

* *Azora is proud to be an equal opportunity employer.*

* *If you need a reasonable accommodation as part of your application for employment or interviews with us, please let us know by contacting* *[email protected]++*

**Export Control**

To conform to U.S. Government export regulations, applicants must be a (i) U.S. citizen or national, (ii) U.S. lawful permanent resident (iii) protected individual as defined by 8 U.S.C. 1324b(a)(3), or (iv) be eligible to obtain the required authorizations from the U.S. Department of State.

**Salary ranges are based on the following criteria:**

* Final salary is based on geographic location, experience, skills, and qualifications.

**About this Company**

Azora is building high-bandwidth communications infrastructure for environments where fiber can't reach. This work spans LEO spacecraft constellations, lunar exploration missions, GEO satcom, deployable optical ground for defense, and data centers both on- and off-world. To enable rapid global proliferation Azora is developing compact and modular optical terminals small enough to deploy from a backpack, and space terminals that support high speed optical links from LEO out to the Moon.