NPI & System Product Engineer

Job Description

**About DriveNets**

DriveNets is a leader in high-scale networking software for AI infrastructure and service providers. The company pioneered a disaggregated networking architecture that transforms the economics of large-scale networks while maximizing performance, utilization, and operational efficiency. DriveNets-powered networks are deployed by global leaders, including AT\&T and Comcast, supporting more than 30% of total U.S. internet traffic. DriveNets AI Fabric delivers full-stack networking for AI infrastructures, providing the highest-performance, Ethernet-based alternative to InfiniBand. The solution is deployed by hyperscalers, NeoClouds, and enterprises worldwide. With over $1B raised, DriveNets continues to push the boundaries of modern networking infrastructure.

**?About the Role**

**We are looking for an NPI \& System Product Engineer** to drive the transition of advanced networking switches and data center infrastructure systems from late-stage R\&D validation \& NPI into scalable mass production.

In this role, you will lead the handoff from **DVT completion into PVT entry** , support the setup and deployment of **new production lines** at global Contract Manufacturers, and execute capacity ramp-up plans toward High-Volume Manufacturing. You will serve as the technical operational link between R\&D design/NPI teams and factory lines, ensuring line balancing, fixture readiness, yield optimization, and hands-on root-cause failure analysis (RCA).

**Key Responsibilities**

**Production Readiness:**

* Support the technical handoff from R\&D DVT exit to Operations PVT readiness.
* Track and verify closure of open DVT hardware issues, check BOM readiness, and validate manufacturing gating criteria before mass production.
* Execute PVT build plans to ensure product design tolerances align with factory process capabilities.

**New Production Line Setup \& Deployment:**

* Participate in the setup, line balancing, and deployment of new manufacturing lines and assembly workcells for chassis and full-rack integrated systems at CM facilities.
* Validate physical workstation setups, line assembly flows, operator guidelines, and improve processes.
* Verify assembly fixtures, press-fit tooling, and automated test stations during new line deployment.
* Create and maintain production test procedures.

**Capacity Ramp-Up \& Takt Time Optimization:**

* Monitor station takt times, identify line bottlenecks, and drive cycle-time reduction initiatives.
* Support the duplication and operational verification of line fixtures, tooling, and test stations to meet capacity scaling targets.
* Track production ramp-up from pilot runs through full-rate High-Volume Manufacturing.

**System Product Engineering \& Yield Optimization:**

* Monitor key manufacturing metrics across PCBA \& box-build assembly lines: First Pass Yield (FPY), Line Fallout, and Scrap Rate.
* Use Statistical Process Control (SPC) and factory telemetry logs to identify systemic yield detractors.
* Assist in refining production test limits, calibration procedures, and screening guardbands during volume ramp.

**Root Cause Analysis (RCA) \& Debugging:**

* Perform hands-on failure triage on system-level dropouts, intermittent hardware faults, and line fallouts during PVT and ramp-up.
* Use schematics, Cadence Allegro board layouts, scopes, JTAG, and diagnostic tools to isolate component vs. process defects.

* B.Sc. in Electrical Engineering, Computer Engineering, or equivalent technical degree.
* 3--5 years of hands-on NPI / System Product Engineering experience specifically in high-performance telecommunications, data center networking switches/routers, enterprise servers, optical hardware.
* Hands-on experience participating in DVT-to-PVT transitions, new production line setup, and factory volume ramp-ups at CM facilities.
* Solid understanding of electronics production processes (Press-fit, boundary scan, functional tests, thermal stress chambers, box-build, and rack integration).
* Good understanding of complex digital architectures: high-throughput network switch ASICs, high-speed SerDes, power delivery subsystems, and optical transceivers.
* Demonstrated ability to isolate intermittent hardware, component, and assembly defects using structured RCA/8D approaches.
* Fluent English (written and verbal); willingness and ability to travel to overseas manufacturing sites for new line deployments, PVT builds, and factory reviews.

**Advantages / Preferred Background**

* Liquid Cooling Manufacturing Experience (Significant Advantage): Practical experience with liquid-cooled hardware in a production environment, including cold-plate assembly, manifold routing, quick-disconnect handling, liquid system processes on production lines.
* Proficiency in data analytics and scripting tools for automated log analysis and yield tracking.
* Working knowledge of enterprise PLM systems (Agile, Arena) and schematic/layout viewers (Allegro / OrCAD).