Raytheon
US - Arizona - Tucson
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Lead and provide technical oversight for RF product packaging design, including antennas, RF circuit card assemblies, radomes, and test equipment, across the product life cycle. Coordinate with engineering teams, customers, and program leadership to define requirements, validate hardware compliance, develop technology roadmaps, and mentor employees.
Requirements: Requires a STEM bachelor's degree and at least five years of relevant experience, including RF product packaging design and analysis using 3D CAD, plus experience creating technical data packages with GD&T. Candidates must be able to obtain an interim U.S. government security clearance before starting; a master's degree and experience in areas such as supplier management, structural or thermal analysis, and requirements verification are preferred.
Key Skills: RF Product Packaging, Mechanical Design, 3D CAD, Technical Data Packages, Geometric Dimensioning and Tolerancing, Multidisciplinary Team Leadership, Technical Oversight, Supplier Management, Structural Analysis, Thermal Analysis, Failure Investigation, Root Cause Analysis, Tolerance Analysis, Requirements Verification, RF PCB Materials, Technical Documentation
Benefits: Medical Insurance, Dental Insurance, Vision Insurance, Life Insurance, Short-Term Disability, Long-Term Disability, 401(k) Match, Flexible Spending Accounts, Flexible Work Schedules, Employee Assistance Program, Employee Scholar Program, Parental Leave, Paid Time Off, Holidays, Relocation Assistance
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